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Ultra-fine tungsten core diamond wire (for semiconductor production)

Ultra-fine tungsten core diamond wire is a material for next-generation semiconductor production.

(Product Introduction) ●Full Name: Ultra-Fine Tungsten Core Diamond Wire ●Category: Cutting Tool ●Application: Diamond Multi-Wire Saw ●Compatibility: Multi-slicing processing of hard and brittle materials such as silicon, sapphire, magnetic neodymium iron, SiC, GaN, etc. ●Features: Compared to the current high-carbon steel core wire (standard: 35μm is the limit), tungsten (standard: 25μm and above) allows for high-tension, fine-diameter multi-slicing cutting, and the cutting surface is a beautiful mirror finish. (Product Specifications) ●Standards: Tungsten Diameter: 25, 30, 35, 40μm ●Model Numbers: D25, D30, D35, D40 ●Packaging: Standard length of 100km roll (can be rolled in lengths of 1km to 200km according to the user's reel shape) ●Weight of 100km roll: D25: 15kg, D30: 20kg, D35: 25kg, D40: 30kg (net weight of W: weight may vary due to Ni plating layer and D electrode layer) ◎Description: Core wire diameter: The wire diameter of high-carbon steel wire saw is about 35μm, which is the limit, but the wire diameter of W wire saw can be thinner with a low breakage rate, so W25 is also usable.